led照明燈的設計制作(畢業(yè)論文).doc
約43頁DOC格式手機打開展開
led照明燈的設計制作(畢業(yè)論文),led照明燈的設計制作(此畢業(yè)論文共25129字) 摘 要基于節(jié)能的需要以及人們對照明質量要求的不斷提高，半導體照明光源以其高效節(jié)能、長壽命、色彩豐富和環(huán)保等特點受到了人們的廣泛關注。大功率發(fā)光二極管作為半導體照明的代表，其性能近來提高很快，發(fā)光效率已超過50 lm/w,有望取代白熾燈、熒光燈和高壓放電等傳統(tǒng)光源，成為...
內容介紹
此文檔由會員 陳海峰 發(fā)布
LED照明燈的設計制作
(此畢業(yè)論文共25129字)
摘 要
基于節(jié)能的需要以及人們對照明質量要求的不斷提高，半導體照明光源以其高效節(jié)能、長壽命、色彩豐富和環(huán)保等特點受到了人們的廣泛關注。大功率發(fā)光二極管作為半導體照明的代表，其性能近來提高很快，發(fā)光效率已超過50 lm/W,有望取代白熾燈、熒光燈和高壓放電等傳統(tǒng)光源，成為人類照明史上的第四代照明光源。目前大功率LED應用于通用照明上還存在著一些問題需解決，比如過高的封裝熱阻和合適的測試方法等。本文研究了大功率LED光源的組裝測試方法，對制作中出現(xiàn)的問題進行了分析和討論，并提出了改善大功率LE與D散熱性能的建議。
文章首先論述了LED封裝與組裝技術的發(fā)展，對多芯片封裝技術在LED照明光源上的應用作了探討。并實際制作了一個由3個由大功率LED串聯(lián)的照明燈，并與傳統(tǒng)的白熾燈和熒光燈進行了比較。
實驗測試結果表明，組裝的LED光源的發(fā)光量、發(fā)光效率均已經(jīng)超過白熾燈，但其性能還不夠穩(wěn)定。單純采用小功率高亮度LED或大功率LED制備的光源存在著光通量低、成本過高和散熱不理想、能耗高等方面的問題，而高亮度LED與大功率LED混合組裝的光源則在發(fā)光效率、成本以及散熱等方面有相對的優(yōu)勢，可應用于室內輔助照明等場合。
關鍵詞：半導體照明，大功率發(fā)光二極管，組裝，測試方法，熱管理
Abstract
With the demand of power saving and the requirement for higher illumination quality, semiconductor lighting sources have been attractive for its excellent characteristics: high efficiency, low power consumption, long source life, color richness and environment friendless etc.As the representative of semiconductor illumination, the performance of high power Light Emitting Diodes(LED)improves quickly resent years and its luminance efficiency has surpassed 50lm/W.Thus high power LED will become the fourth generation lighting source replacing incandescent, fluorescent and high intensity discharge (HID)lamp. Otherwise some key issues should be solved before high power LEDs widely application in general illumination market, such as package heat management and suitable measurement method. This thesis focuses on high power LED lighting sources and researches their assembly and measurement process.Consequently; we analyze and discuss the problems found in this process. Finally the suggestion is proposed to improve thermal dissipation for high power LED.
The development of LED package and assembly technology is discussed, especially on the application of multichip package technique for LED lighting sources. And the actual production of a 3 by high-power LED lights series. And with the traditional incandescent and fluorescent lamps are compared.
Test results show that LED light source assembly of light-emitting volume, light-emitting efficiency than incandescent, but its performance was not enough stability. Comparing with the homogeneous combination of low power high brightness LEDs(HB-LEDs)or high power LEDs,the hybrid combination of HB-LEDs/high power LEDs has higher luminous efficiency,lower cost and better heat dissipation ability,thus it can be applied in fields for home decorate lighting and outdoor illuminance.
Key words: Semiconductor illumination, High power Light Emitting Diodes (LED), Assembly, Measurement method, Heat management
目 錄
1引言....................................................... ........................1
1.1半導體照明光源的提出1
1.2 LED的特性1
1.3 LED照明現(xiàn)狀及發(fā)展趨勢4
1.4相關光度學參數(shù)簡介7
1.5本課題的研究內容7
2 LED的封裝與組裝8
2.1 LED封裝方法的分類8
2.2功率型LED封裝存在的問題9
2.3封裝發(fā)展趨勢9
2.4新穎的LED陣列封裝技術——流體自組裝10
3 LED光源的光電參數(shù)13
3.1 LED發(fā)白光的原理13
3.2 LED特征參數(shù)簡介13
3.3LED照明光源光度參數(shù)的計算14
4 LED照明光源的制備17
4.1 LED吊頂燈與射燈的設計17
4.2 LED光源驅動電路18
4.3串聯(lián)調整型穩(wěn)流電源工作原理23
4.4便攜式LED采用的驅動設備26
4.5照明光源的組裝28
4.6實驗測試與結果分析29
5 LED的散熱問題及解決方案32
5.1熱對LED的影響32
5.2 LED光源的熱傳導和疏散32
5.3實際制作的LED散熱器及測試32
6結論34
參考文獻35
致謝36
外文資料原文37
譯文39
(此畢業(yè)論文共25129字)
摘 要
基于節(jié)能的需要以及人們對照明質量要求的不斷提高，半導體照明光源以其高效節(jié)能、長壽命、色彩豐富和環(huán)保等特點受到了人們的廣泛關注。大功率發(fā)光二極管作為半導體照明的代表，其性能近來提高很快，發(fā)光效率已超過50 lm/W,有望取代白熾燈、熒光燈和高壓放電等傳統(tǒng)光源，成為人類照明史上的第四代照明光源。目前大功率LED應用于通用照明上還存在著一些問題需解決，比如過高的封裝熱阻和合適的測試方法等。本文研究了大功率LED光源的組裝測試方法，對制作中出現(xiàn)的問題進行了分析和討論，并提出了改善大功率LE與D散熱性能的建議。
文章首先論述了LED封裝與組裝技術的發(fā)展，對多芯片封裝技術在LED照明光源上的應用作了探討。并實際制作了一個由3個由大功率LED串聯(lián)的照明燈，并與傳統(tǒng)的白熾燈和熒光燈進行了比較。
實驗測試結果表明，組裝的LED光源的發(fā)光量、發(fā)光效率均已經(jīng)超過白熾燈，但其性能還不夠穩(wěn)定。單純采用小功率高亮度LED或大功率LED制備的光源存在著光通量低、成本過高和散熱不理想、能耗高等方面的問題，而高亮度LED與大功率LED混合組裝的光源則在發(fā)光效率、成本以及散熱等方面有相對的優(yōu)勢，可應用于室內輔助照明等場合。
關鍵詞：半導體照明，大功率發(fā)光二極管，組裝，測試方法，熱管理
Abstract
With the demand of power saving and the requirement for higher illumination quality, semiconductor lighting sources have been attractive for its excellent characteristics: high efficiency, low power consumption, long source life, color richness and environment friendless etc.As the representative of semiconductor illumination, the performance of high power Light Emitting Diodes(LED)improves quickly resent years and its luminance efficiency has surpassed 50lm/W.Thus high power LED will become the fourth generation lighting source replacing incandescent, fluorescent and high intensity discharge (HID)lamp. Otherwise some key issues should be solved before high power LEDs widely application in general illumination market, such as package heat management and suitable measurement method. This thesis focuses on high power LED lighting sources and researches their assembly and measurement process.Consequently; we analyze and discuss the problems found in this process. Finally the suggestion is proposed to improve thermal dissipation for high power LED.
The development of LED package and assembly technology is discussed, especially on the application of multichip package technique for LED lighting sources. And the actual production of a 3 by high-power LED lights series. And with the traditional incandescent and fluorescent lamps are compared.
Test results show that LED light source assembly of light-emitting volume, light-emitting efficiency than incandescent, but its performance was not enough stability. Comparing with the homogeneous combination of low power high brightness LEDs(HB-LEDs)or high power LEDs,the hybrid combination of HB-LEDs/high power LEDs has higher luminous efficiency,lower cost and better heat dissipation ability,thus it can be applied in fields for home decorate lighting and outdoor illuminance.
Key words: Semiconductor illumination, High power Light Emitting Diodes (LED), Assembly, Measurement method, Heat management
目 錄
1引言....................................................... ........................1
1.1半導體照明光源的提出1
1.2 LED的特性1
1.3 LED照明現(xiàn)狀及發(fā)展趨勢4
1.4相關光度學參數(shù)簡介7
1.5本課題的研究內容7
2 LED的封裝與組裝8
2.1 LED封裝方法的分類8
2.2功率型LED封裝存在的問題9
2.3封裝發(fā)展趨勢9
2.4新穎的LED陣列封裝技術——流體自組裝10
3 LED光源的光電參數(shù)13
3.1 LED發(fā)白光的原理13
3.2 LED特征參數(shù)簡介13
3.3LED照明光源光度參數(shù)的計算14
4 LED照明光源的制備17
4.1 LED吊頂燈與射燈的設計17
4.2 LED光源驅動電路18
4.3串聯(lián)調整型穩(wěn)流電源工作原理23
4.4便攜式LED采用的驅動設備26
4.5照明光源的組裝28
4.6實驗測試與結果分析29
5 LED的散熱問題及解決方案32
5.1熱對LED的影響32
5.2 LED光源的熱傳導和疏散32
5.3實際制作的LED散熱器及測試32
6結論34
參考文獻35
致謝36
外文資料原文37
譯文39
